| 2022 | |
| [1] | Chixiao Chen, Jieming Yin, Yarui Peng, Maurizio Palesi, Wenxu Cao, Letian Huang, Amit Kumar Singh, Haocong Zhi, and Xiaohang Wang, “Design Challenges of Intra- and Inter- Chiplet Interconnection”, IEEE Design & Test, vol. 39, no. 6, pp. 99–109, 2022. |
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| 2022 | |
| [2] | Imam Al Razi, Whit Vinson, David Huitink, and Yarui Peng, “Electromigration-Aware Reliability Optimization of MCPM Layouts Using PowerSynth”, in Proc. IEEE Energy Conversion Congress and Exposition, pp. 1-8, Oct 2022. |
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| [1] | Quang Le, Md. Maksudul Hossain, Tristan Evans, Yarui Peng, and H. Alan Mantooth, “Thermal Runaway Mitigation through Electrothermal Constraints Mapping for MCPM Layout Optimization”, in Proc. IEEE Design Methodologies Conference, pp. 1-6, Sep 2022. |
| 2022 | |
| [1] | Imam Al Razi, “Constraint-Aware, Scalable, and Efficient Algorithms for Multi-Chip Power Module Layout Optimization”, Ph.D. dissertation, University of Arkansas, Fayetteville, AR, 2022. |
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