| [4] | Bakhtiyar Md Nafis, Ange Iradukunda, Imam Al Razi, David Huitink, and Yarui Peng, “System-level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles”, in Proc. ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, pp. 1–8, Oct 2019.
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| [3] | Tristan Evans, Quang Le, Balaji Narayanasamy, Yarui Peng, Fang Luo, and H. Alan Mantooth, “Development of EDA Techniques for Power Module EMI Modeling and Layout Optimization”, in Proc. IMAPS International Symposium on Microelectronics, pp. 193–198, Oct 2019.
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| [2] | Imam Al Razi, Quang Le, H. Alan Mantooth, and Yarui Peng, “Hierarchical Layout Synthesis and Design Automation for 2.5D Heterogeneous Multi-Chip Power Modules”, in Proc. IEEE Energy Conversion Congress and Exposition, pp. 2257–2263, Sep 2019.
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| [1] | Quang Le, Tristan Evans, Yarui Peng, and H. Alan Mantooth, “PEEC Method and Hierarchical Approach Towards 3D Multichip Power Module (MCPM) Layout Optimization”, in Proc. IEEE International Workshop on Integrated Power Packaging, pp. 131–136, Apr 2019.
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