Refereed Journals
2014
[1]Yarui Peng, Taigon Song, Dusan Petranovic, and Sung Kyu Lim, “Silicon Effect-Aware Full-Chip Extraction and Mitigation of TSV-to-TSV Coupling”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 33, no. 12, pp. 1900–1913, Dec 2014. BibTex DOI IEEE PDF
Refereed Conference Papers
2014
[4]Sandeep Samal, Yarui Peng, and Sung Kyu Lim, “Design and Analysis of Ultra Low Power Processors Using Sub/Near-Threshold 3D Stacked ICs”, in Proc. SRC TECHCON Conference, pp. 1–4, Sep 2014. BibTex
[3]Yarui Peng, Taigon Song, Dusan Petranovic, and Sung Kyu Lim, “On Accurate Full-chip Extraction and Optimization of TSV-to-TSV Coupling Elements in 3D ICs”, in Proc. SRC TECHCON Conference, pp. 1–4, Sep 2014, Best in Session Award. BibTex PPT PDF
[2]Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, and Sung Kyu Lim, “On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective”, in Proc. Design Automation Conference, pp. 1–6, Jun 2014. BibTex DOI IEEE PDF
[1]Yarui Peng, Dusan Petranovic, and Sung Kyu Lim, “Fast and Accurate Full-chip Extraction and Optimization of TSV-to-wire Coupling”, in Proc. Design Automation Conference, pp. 1–6, Jun 2014. BibTex DOI IEEE PPT PDF