by Yarui Peng, Bon Woong Ku, Younsik Park, Kwang-Il Park, Seong-Jin Jang, Joo Sun Choi, and Sung Kyu Lim
Reference:
Yarui Peng, Bon Woong Ku, Younsik Park, Kwang-Il Park, Seong-Jin Jang, Joo Sun Choi, and Sung Kyu Lim, “Design, Packaging, and Architectural Policy Co-Optimization for DC Power Integrity in 3D DRAM”, in Proc. Design Automation Conference, pp. 1–6, Jun 2015.
Bibtex Entry:
@string{conf.acm.dac="Design Automation Conference"}
@InProceedings{Y.Peng-Conf.ACM.DAC-2015,

	author    = {Yarui Peng and Bon Woong Ku and Younsik Park and Kwang-Il Park and Seong-Jin Jang and Joo Sun Choi and Sung Kyu Lim},
	title     = {{Design, Packaging, and Architectural Policy Co-Optimization for {DC} Power Integrity in {3D} DRAM}},
	booktitle = Conf.ACM.DAC,
	year      = {2015},
	pages     = {1--6},
	month     = jun,
	doi       = {10.1145/2744769.2744819},
	ieee      = {7167275},
	issn      = {0738-100X},
}