by Taigon Song, Moongon Jung, Yang Wan, Yarui Peng, and Sung Kyu Lim
Reference:
Taigon Song, Moongon Jung, Yang Wan, Yarui Peng, and Sung Kyu Lim, “3D IC Power Benefit Study Under Practical Design Considerations”, in Proc. International Interconnect Technology Conference, pp. 335–338, May 2015.
Bibtex Entry:
@string{conf.ieee.iitc="International Interconnect Technology Conference"}
@InProceedings{T.Song-Conf.IEEE.IITC-2015,

	author    = {Taigon Song and Moongon Jung and Yang Wan and Yarui Peng and Sung Kyu Lim},
	title     = {{3D {IC} Power Benefit Study Under Practical Design Considerations}},
	booktitle = Conf.IEEE.IITC,
	year      = {2015},
	pages     = {335--338},
	month     = may,
	doi       = {10.1109/Conf.IEEE.IITC-MAM.2015.7325594},
	ieee      = {7325594},
	issn      = {2380-632X},
}