by Quang Le, Tristan Evans, Yarui Peng, and H. Alan Mantooth
Reference:
Quang Le, Tristan Evans, Yarui Peng, and H. Alan Mantooth, “PEEC Method and Hierarchical Approach Towards 3D Multichip Power Module (MCPM) Layout Optimization”, in Proc. IEEE International Workshop on Integrated Power Packaging, pp. 131–136, Apr 2019.
Bibtex Entry:
@string{work.ieee.iwipp="IEEE International Workshop on Integrated Power Packaging"}
@InProceedings{Q.Le-Work.IEEE.IWIPP-2019,
	author    = {Quang Le and Tristan Evans and Yarui Peng and H. Alan Mantooth},
	title     = {{PEEC Method and Hierarchical Approach Towards 3D Multichip Power Module (MCPM) Layout Optimization}},
	booktitle = Work.IEEE.IWIPP,
	year      = {2019},
	pages     = {131--136},
	month     = apr,
	doi       = {10.1109/IWIPP.2019.8799081},
	ieee      = {8799081},
	keywords  = {MCPMs;parasitics;layout optimization},
}