by Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, and Sung Kyu Lim
Reference:
Moongon Jung, Taigon Song, Yang Wan, Yarui Peng, and Sung Kyu Lim, “On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective”, in Proc. Design Automation Conference, pp. 1–6, Jun 2014.
Bibtex Entry:
@string{conf.acm.dac="Design Automation Conference"}
@InProceedings{M.Jung-Conf.ACM.DAC-2014,

	author    = {Moongon Jung and Taigon Song and Yang Wan and Yarui Peng and Sung Kyu Lim},
	title     = {{On Enhancing Power Benefits in 3D ICs: Block Folding and Bonding Styles Perspective}},
	booktitle = Conf.ACM.DAC,
	year      = {2014},
	pages     = {1--6},
	month     = jun,
	doi       = {10.1145/2593069.2593167},
	ieee      = {6881331},
	issn      = {0738-100X},
}