by Md. Arafat Kabir, and Yarui Peng
Reference:
Md. Arafat Kabir, and Yarui Peng, “Chiplet-Package Co-Design For 2.5D Systems Using Standard ASIC CAD Tools”, in Proc. Asia and South Pacific Design Automation Conference, pp. 351–356, Jan 2020.
Bibtex Entry:
@string{conf.ieee.asp-dac="Asia and South Pacific Design Automation Conference"}
@InProceedings{M.A.Kabir-Conf.IEEE.ASP-DAC-2020,
	author    = {{Md. Arafat} Kabir and Yarui Peng},
	title     = {{Chiplet-Package Co-Design For 2.5D Systems Using Standard ASIC CAD Tools}},
	booktitle = Conf.IEEE.ASP-DAC,
	year      = {2020},
	doi = {10.1109/ASP-DAC47756.2020.9045734},
	ieee= {9045734},
	pages={351--356},
	month   = jan,
}