by Md. Arafat Kabir, Dusan Petranovic, and Yarui Peng
Reference:
Md. Arafat Kabir, Dusan Petranovic, and Yarui Peng, “Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-Design”, in Proc. ACM Great Lakes Symposium on VLSI, pp. 135–140, Jun 2021.
Bibtex Entry:
@string{conf.acm.glsvlsi="ACM Great Lakes Symposium on VLSI"}
@InProceedings{M.A.Kabir-Conf.ACM.GLSVLSI-2021,
	author    ={{Md. Arafat} Kabir and Dusan Petranovic and Yarui Peng},
	title     = {{Cross-Boundary Inductive Timing Optimization for 2.5D Chiplet-Package Co-Design}},
	booktitle = Conf.ACM.GLSVLSI,
	doi = {10.1145/3453688.3461505},
	month = jun,
	pages = {135--140},
	year      = {2021},
}