by Can Rao, Tongqing Wang, Yarui Peng, Jie Cheng, Yuhong Liu, Sung Kyu Lim, and Xinchun Lu
Reference:
Can Rao, Tongqing Wang, Yarui Peng, Jie Cheng, Yuhong Liu, Sung Kyu Lim, and Xinchun Lu, “Residual Stress and Pop-Out Simulation for TSVs and Contacts in Via-Middle Processing”, IEEE Transactions on Semiconductor Manufacturing, vol. 30, no. 2, pp. 143–154, May 2017.
Bibtex Entry:
@string{ieee.tsm="IEEE Transactions on Semiconductor Manufacturing"}
@Article{C.Rao-IEEE.TSM-2017,

	author  = {Can Rao and Tongqing Wang and Yarui Peng and Jie Cheng and Yuhong Liu and Sung Kyu Lim and Xinchun Lu},
	title   = {{Residual Stress and Pop-Out Simulation for TSVs and Contacts in Via-Middle Processing}},
	journal = IEEE.TSM,
	year    = {2017},
	volume  = {30},
	number  = {2},
	pages   = {143--154},
	month   = may,
	doi     = {10.1109/IEEE.TSM.2017.2688498},
	ieee    = {7888577},
	issn    = {0894-6507},
}