by Zhen Zhuang, Weishiun Hung,
Md. Arafat Kabir,
Yarui Peng, and Tsung-Yi Ho
Reference:
Zhen Zhuang, Weishiun Hung, Md. Arafat Kabir, Yarui Peng, and Tsung-Yi Ho, “Adaptive Redistribution Layer Routing for Chiplet-Package Co-Design in 2.5D System”, (accepted) ACM Transactions on Design Automation of Electronic Systems, 2025.
Bibtex Entry:
@string{acm.todaes="ACM Transactions on Design Automation of Electronic Systems"}
@article{Z.Zhuang-ACM.TODAES-2025,
author = {Zhen Zhuang and Weishiun Hung and Md. Arafat Kabir and Yarui Peng and Tsung-Yi Ho},
title = {{Adaptive Redistribution Layer Routing for Chiplet-Package Co-Design in 2.5D System}},
year = {2025},
journal = ACM.TODAES,
issn = {1084-4309},
doi = {10.1145/3723043}
}