by Yarui Peng, Dusan Petranovic, and Sung Kyu Lim
Reference:
Yarui Peng, Dusan Petranovic, and Sung Kyu Lim, “Die-to-Package Coupling Extraction for Fan-Out Wafer-Level-Packaging”, in Proc. IEEE Electrical Design of Advanced Packaging and Systems Symposium, pp. 1–3, Dec 2017, Best Paper Award.
Bibtex Entry:
@string{misc.conf.edaps="IEEE Electrical Design of Advanced Packaging and Systems Symposium"}
@InProceedings{Y.Peng-Misc.Conf.EDAPS-2017,
	author    = {Yarui Peng and Dusan Petranovic and Sung Kyu Lim},
	title     = {{Die-to-Package Coupling Extraction for Fan-Out Wafer-Level-Packaging}},
	booktitle = Misc.Conf.EDAPS,
	year      = {2017},
	month     = dec,
	note      = {Best Paper Award},
	doi       = {10.1109/EDAPS.2017.8277047},
	pages={1--3},
	ieee      = {8277047},
}