by Yarui Peng, Taigon Song, Dusan Petranovic, and Sung Kyu Lim
Reference:
Yarui Peng, Taigon Song, Dusan Petranovic, and Sung Kyu Lim, “Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded 3D ICs”, in Proc. International Conference on Computer-Aided Design, pp. 649–655, Nov 2015.
Bibtex Entry:
@string{conf.ieee.iccad="International Conference on Computer-Aided Design"}
@InProceedings{Y.Peng-Conf.IEEE.ICCAD-2015,

	author    = {Yarui Peng and Taigon Song and Dusan Petranovic and Sung Kyu Lim},
	title     = {{Full-chip Inter-die Parasitic Extraction in Face-to-Face-Bonded {3D} ICs}},
	booktitle = Conf.IEEE.ICCAD,
	year      = {2015},
	pages     = {649--655},
	month     = nov,
	doi       = {10.1109/Conf.IEEE.ICCAD.2015.7372631},
	ieee      = {7372631},
}