by Taigon Song, Chang Liu, Yarui Peng, and Sung Kyu Lim
Reference:
Taigon Song, Chang Liu, Yarui Peng, and Sung Kyu Lim, “Full-chip Multiple TSV-to-TSV Coupling Extraction and Optimization in 3D ICs”, in Proc. Design Automation Conference, pp. 1–7, May 2013.
Bibtex Entry:
@string{conf.acm.dac="Design Automation Conference"}
@InProceedings{T.Song-Conf.ACM.DAC-2013,

	author    = {Taigon Song and Chang Liu and Yarui Peng and Sung Kyu Lim},
	title     = {{Full-chip Multiple TSV-to-TSV Coupling Extraction and Optimization in {3D} ICs}},
	booktitle = Conf.ACM.DAC,
	year      = {2013},
	pages     = {1--7},
	month     = may,
	ieee      = {6560773},
	issn      = {0738-100X},
}