by Md. Arafat Kabir, Weishiun Hung, Tsung-Yi Ho, and Yarui Peng
Reference:
Md. Arafat Kabir, Weishiun Hung, Tsung-Yi Ho, and Yarui Peng, “Holistic and In-Context Design Flow for 2.5D Chiplet-Package Interaction Co-Optimization”, in Proc. International Symposium on VLSI Design, Automation and Test, pp. 1–4, May 2021, Invited Paper.
Bibtex Entry:
@string{misc.conf.vlsi-dat="International Symposium on VLSI Design, Automation and Test"}
@InProceedings{M.A.Kabir-Misc.Conf.VLSI-DAT-2021,
	author    ={{Md. Arafat} Kabir and Weishiun Hung and Tsung-Yi Ho and Yarui Peng},
	title     = {{Holistic and In-Context Design Flow for 2.5D Chiplet-Package Interaction Co-Optimization}},
	booktitle = Misc.Conf.VLSI-DAT,
	 year={2021},
ieee={9427353},
  pages={1--4},
  doi={10.1109/VLSI-DAT52063.2021.9427353},
  month = may,
	note = {Invited Paper},
}