Reference:
Md. Arafat Kabir, and Yarui Peng, “Holistic Chiplet-Package Co-Optimization for Agile Custom 2.5D Design”, IEEE Transactions on Components, Packaging, and Manufacturing Technology, vol. 11, no. 5, pp. 715–726, 2021.
Bibtex Entry:
@string{ieee.tcpmt="IEEE Transactions on Components, Packaging, and Manufacturing Technology"}
@Article{M.A.Kabir-IEEE.TCPMT-2021,
author={{Md. Arafat} Kabir and Yarui Peng},
title = {{Holistic Chiplet-Package Co-Optimization for Agile Custom 2.5D Design}},
journal = IEEE.TCPMT,
year = {2021},
ieee={9389804},
volume={11},
number={5},
pages={715--726},
doi={10.1109/TCPMT.2021.3069724},
}