by David Huitink, Whit Vinson, Collin Ruby, Imam Al Razi, David Agogo-Mawuli, H. Alan Mantooth, and Yarui Peng
Reference:
David Huitink, Whit Vinson, Collin Ruby, Imam Al Razi, David Agogo-Mawuli, H. Alan Mantooth, and Yarui Peng, “Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules”, Journal of Microelectronics and Electronic Packaging, vol. 20, no. 4, pp. 107–111, 2023.
Bibtex Entry:
@string{misc.imaps.jmep="Journal of Microelectronics and Electronic Packaging"}
@article{D.Huitink-Misc.IMAPS.JMEP-2023,
	journal=Misc.IMAPS.JMEP,
	doi={10.4071/001c.91213},
	number=4,
	title={{Factoring Interacting Stress Mechanisms in Design for Reliability of Extreme Environment Power Modules}},
	volume=20,
	author={David Huitink and Whit Vinson and Collin Ruby and Imam {Al Razi} and David Agogo-Mawuli and H. Alan Mantooth and Yarui Peng},
	pages={107--111},
	year=2023,
}