| [6] | Md. Arafat Kabir, Dusan Petranovic, and Yarui Peng, “Coupling Extraction and Optimization for Heterogeneous 2.5D Chiplet-Package Co-Design”, in Proc. International Conference on Computer-Aided Design, pp. 1–8, Nov 2020.
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| [5] | Imam Al Razi, Quang Le, H. Alan Mantooth, and Yarui Peng, “Physical Design Automation for High-Density 3D Power Module Layout Synthesis and Optimization”, in Proc. IEEE Energy Conversion Congress and Exposition, pp. 1984–1991, Oct 2020.
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| [4] | Tristan Evans, Shilpi Mukherjee, Yarui Peng, and H. Alan Mantooth, “Electronic Design Automation (EDA) Tools and Considerations for Electro-Thermo-Mechanical Co-Design of High Voltage Power Modules”, in Proc. IEEE Energy Conversion Congress and Exposition, pp. 5046–5052, Oct 2020.
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| [3] | Md. Arafat Kabir, and Yarui Peng, “Holistic 2.5D Chiplet Design Flow: A 65nm Shared-Block Microcontroller Case Study”, in Proc. IEEE International System-on-Chip Conference, pp. 277-282, Sep 2020.
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| [2] | Shilpi Mukherjee, Yarui Peng, and Alan Mantooth, “General Equation to Determine Design Rules for Mitigating Partial Discharge and Electrical Breakdown in Power Module Layouts”, in Proc. IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia, pp. 1–6, Sep 2020.
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| [1] | Md. Arafat Kabir, and Yarui Peng, “Chiplet-Package Co-Design For 2.5D Systems Using Standard ASIC CAD Tools”, in Proc. Asia and South Pacific Design Automation Conference, pp. 351–356, Jan 2020.
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