by Yarui Peng, Moongon Jung, Taigon Song, Yang Wan, and Sung Kyu Lim
Reference:
Yarui Peng, Moongon Jung, Taigon Song, Yang Wan, and Sung Kyu Lim, “Thermal Impact Study of Block Folding and Face-to-Face Bonding in 3D IC”, in Proc. International Interconnect Technology Conference, pp. 331–334, May 2015.
Bibtex Entry:
@string{conf.ieee.iitc="International Interconnect Technology Conference"}
@InProceedings{Y.Peng-Conf.IEEE.IITC-2015,

	author    = {Yarui Peng and Moongon Jung and Taigon Song and Yang Wan and Sung Kyu Lim},
	title     = {{Thermal Impact Study of Block Folding and Face-to-Face Bonding in {3D} IC}},
	booktitle = Conf.IEEE.IITC,
	year      = {2015},
	pages     = {331--334},
	month     = may,
	doi       = {10.1109/Conf.IEEE.IITC-MAM.2015.7325593},
	ieee      = {7325593},
	issn      = {2380-632X},
}