by Yarui Peng, Dusan Petranovic, and Sung Kyu Lim
Reference:
Yarui Peng, Dusan Petranovic, and Sung Kyu Lim, “Chip/Package Co-Analysis and Inductance Extraction for Fan-Out Wafer-Level-Packaging”, in Proc. IEEE Conference on Electrical Performance of Electronic Packaging and Systems, pp. 1–3, Oct 2017.
Bibtex Entry:
@string{conf.ieee.epeps="IEEE Conference on Electrical Performance of Electronic Packaging and Systems"}
@InProceedings{Y.Peng-Conf.IEEE.EPEPS-2017,
	author    = {Yarui Peng and Dusan Petranovic and Sung Kyu Lim},
	title     = {{Chip/Package Co-Analysis and Inductance Extraction for Fan-Out Wafer-Level-Packaging}},
	booktitle = Conf.IEEE.EPEPS,
	year      = {2017},
	pages     = {1--3},
	month     = oct,
	doi       = {10.1109/EPEPS.2017.8329749},
	ieee      = {8329749},
}